李月明;张华;洪燕;王竹梅;沈宗洋;

• 1:景德镇陶瓷学院材料科学与工程学院

摘要(Abstract)：

高介电常数微波介质材料是实现现代微波通信器件要求的微型化、集成化发展趋势的重要材料,针对多层结构设计的器件要求,需要微波介质陶瓷能与高电导率电极实现低温共烧。本文综述了近年来高介电常数微波介质陶瓷及其低温烧结研究的最新进展,指出进一步提高陶瓷的介电常数和研究新型低温烧结助剂是今后发展的趋势。

关键词(KeyWords)： 微波介质陶瓷;高介电常数;低温烧结

Abstract:

Keywords:

基金项目(Foundation): 江西省教育厅科技项目(编号:GJJ10562)

作者(Authors): 李月明;张华;洪燕;王竹梅;沈宗洋;

DOI: 10.13958/j.cnki.ztcg.2010.05.012

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