秦典成;李保忠;肖永龙;

• 1:乐健科技(珠海)有限公司广东省LED封装散热基板工程技术研究中心

摘要(Abstract)：

陶瓷作为一种导热率较高的新兴散热材料,在大功率电子元器件封装散热领域优势凸显。陶瓷表面金属化是陶瓷基板在功率型电子封装领域获得实际应用的重要环节,且金属化层的好坏将直接影响到功率型电子元器件的可靠性与使用寿命。本文在查阅并参考国内外权威文献资料的基础上,系统论述了陶瓷作为高导热的散热基板材料,其表面金属化的研究现状及发展趋势。并着重介绍了陶瓷金属化的新工艺及在其它领域的新应用。

关键词(KeyWords)： 陶瓷;基板;封装;高导热;金属化

Abstract:

Keywords:

基金项目(Foundation):

作者(Authors): 秦典成;李保忠;肖永龙;

DOI: 10.13958/j.cnki.ztcg.2017.05.005

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